HF115AC-0.0055-AC-54 Espesifikasyon teknoloji

THERM PAD 19.05MMX12.7MM W/ADH

Atribi pwodwi Valè atribi
Category Fann, Jere Tèmik / Thermal - Pads, Sheets
Manufacturer Bergquist
Factory Lead Time 3 Weeks
Usage TO-220
Thickness 0.0055" (0.140mm)
Thermal Conductivity 0.8 W/m-K
Series Hi-Flow® 115-AC
Other Names BER167 BG426641 HF115AC-54 HF115AC00055AC54 HF115TAAC-54
Material Phase Change Compound
Lead Free Status / RoHS Status Lead free / RoHS Compliant
Color Gray
Adhesive Adhesive - One Side
Atribi pwodwi Valè atribi
Part Status Active
RoHS Status ROHS3 Compliant
Pbfree Code yes
Type Pad, Sheet
Thermal Resistivity 0.35°C/W
Shape Rectangular
Outline 19.05mm x 12.70mm
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Manufacturer Standard Lead Time 2 Weeks
Detailed Description Thermal Pad Gray 19.05mm x 12.70mm Rectangular Adhesive - One Side
Backing, Carrier Fiberglass
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HF115AC-0.0055-AC-54 Dokiman yo

Telechaje fichye done ak dokiman manifakti pou HF115AC-0.0055-AC-54

Gen lòt ki genyen ladan yo   "HF115"   pati

Pati sa yo genyen ladan yo  'HF115' 

Pati # Manifakti Kategori Disponibilite
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HF115AC-0.0055-AC-54 manifaktirè mak: Bergquist, Bonchip stock, HF115AC-0.0055-AC-54 pri referans. HF115AC-0.0055-AC-54 paramèt, HF115AC-0.0055-AC-54 Fichye PDF ak deskripsyon dyagram pin download.Ou ka itilize HF115AC-0.0055-AC-54 Pluggable Connectors, DSP Datesheet PDF, jwenn HF115AC-0.0055-AC-54 dyagram pin ak dyagram sikwi ak metòd itilizasyon fonksyon, HF115AC-0.0055-AC-54 leson patikilye elektwonik.Ou ka telechaje soti nan Bonchip.
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