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T356F156M020AS Espesifikasyon teknoloji

15 uF, 20 VDC (85C), 13 VDC (125C), 0.2 VDC (125C Reverse), -55/+125°C

Atribi pwodwi Valè atribi
Category T356F156M020AS
Manufacturer KEMET
Factory Lead Time 3 Weeks
Package / Case Dipped
Terminal Shape WIRE
Dielectric Material TANTALUM (DRY/SOLID)
Tolerance 20%
Pbfree Code no
Termination Radial
Terminal Finish Tin/Lead (Sn60Pb40)
Min Operating Temperature -55°C
Capacitance 15μF
Lead Pitch 5.08mm
Polarity Polar
Leakage Current 0.0024mA
Dissipation Factor 6 %
Height 11.2mm
Radiation Hardening No
Atribi pwodwi Valè atribi
Part Status Active
RoHS Status ROHS3 Compliant
Pbfree Code yes
Surface Mount NO
Mounting Feature THROUGH HOLE MOUNT
Packaging Bulk
JESD-609 Code e0
Number of Terminations 2
ECCN Code EAR99
Max Operating Temperature 125°C
HTS Code 8532.21.00.40
Packing Method TR
Capacitor Type TANTALUM CAPACITOR
Rated (DC) Voltage (URdc) 20V
Tan Delta 0.06
ESR 2300 mΩ
Length 6mm
RoHS Status Non-RoHS Compliant
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T356F156M020AS Dokiman yo

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Gen lòt ki genyen ladan yo   "T356F"   pati

Pati sa yo genyen ladan yo  'T356F' 

Pati # Manifakti Kategori Disponibilite
T356F156J020AT KEMET T356F156J020AT
T356F156K020AS KEMET T356F156K020AS
T356F156K020AT KEMET T356F156K020AT
T356F156M020AT KEMET T356F156M020AT
T356F226K016AS KEMET Tantalum Kondansatè 2606
T356F226K016ASTR KEMET T356F226K016ASTR
T356F226K016AT KEMET Tantalum Kondansatè 2615
T356F226K016ATTR KEMET T356F226K016ATTR
T356F226M016AS KEMET T356F226M016AS
T356F226M016AT KEMET Tantalum Kondansatè 2607

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Livrezon nan vitès plen
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Imèl : [email protected]

Adrès : D1 6th floor,Lehui Center,Jihua Road 489 Longgang District, Shenzhen-518129, China

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T356F156M020AS manifaktirè mak: KEMET, Bonchip stock, T356F156M020AS pri referans. T356F156M020AS paramèt, T356F156M020AS Fichye PDF ak deskripsyon dyagram pin download.Ou ka itilize T356F156M020AS Pluggable Connectors, DSP Datesheet PDF, jwenn T356F156M020AS dyagram pin ak dyagram sikwi ak metòd itilizasyon fonksyon, T356F156M020AS leson patikilye elektwonik.Ou ka telechaje soti nan Bonchip.
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