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A17820-08 Espesifikasyon teknoloji

TFLEX HD92000,DC1

Atribi pwodwi Valè atribi
Category Fann, Jere Tèmik / Thermal - Pads, Sheets
Manufacturer Laird Technologies - Thermal Products
Factory Lead Time 3 Weeks
Usage CPU
Thickness 0.0800" (2.032mm)
Thermal Conductivity 7.5 W/m-K
Series Tflex™ HD90000
Material Silicone, Ceramic Filled
Lead Free Status / RoHS Status Lead free / RoHS Compliant
Color Gray
Adhesive Tacky - One Side
Atribi pwodwi Valè atribi
Part Status Active
RoHS Status ROHS3 Compliant
Pbfree Code yes
Type Gap Filler Pad, Sheet
Thermal Resistivity -
Shape Square
Outline 457.20mm x 457.20mm
Manufacturer Standard Lead Time 4 Weeks
Detailed Description Thermal Pad Gray 457.20mm x 457.20mm Square Tacky - One Side
Backing, Carrier -
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A17820-08 Laird Technologies - Thermal Materials Pad Termik
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Tel : 86-755-86374759

Imèl : [email protected]

Adrès : D1 6th floor,Lehui Center,Jihua Road 489 Longgang District, Shenzhen-518129, China

Gid pou fè makèt

Shipping Peryòd livrezon Pakè yo pral ranje pou livrezon nan 1-2 jou apati dat tout atik yo rive nan depo nou an. Atik nan stock yo ka anbake soti nan 24 èdtan. Tan livrezon depann sou Metòd livrezon ak destinasyon livrezon.
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Si ou gen nenpòt pwoblèm operasyon, tanpri ou lib pou kontakte sèvis kliyan nou an.
Peman TT davans (transfè labank), Western Union, kat kredi, PayPal. Kliyan responsab pou frè anbake, frè labank, devwa ak taks.
A17820-08 manifaktirè mak: Laird Technologies - Thermal Products, Bonchip stock, A17820-08 pri referans. A17820-08 paramèt, A17820-08 Fichye PDF ak deskripsyon dyagram pin download.Ou ka itilize A17820-08 Pluggable Connectors, DSP Datesheet PDF, jwenn A17820-08 dyagram pin ak dyagram sikwi ak metòd itilizasyon fonksyon, A17820-08 leson patikilye elektwonik.Ou ka telechaje soti nan Bonchip.
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