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MS-104-3-2 Espesifikasyon teknoloji

MICRO REED SENSOR PITCH 10.16 MM

Atribi pwodwi Valè atribi
Category Switchè / Magnetik Reed Swich yo
Manufacturer PIC GmbH
Factory Lead Time 3 Weeks
Factory Lead Time 12 Weeks
Operating Temperature -20°C~85°C
Part Status Active
Type Molded Body
Circuit SPST-NO
Release Time 0.1ms
Size - Body 0.449Lx0.106W x 0.110 H 11.40mmx2.70mmx2.80mm
Operate Range 15 ~ 20AT
Voltage - Switching AC 120V
Release Range 4AT
Height Above Board 0.110 2.80mm
Atribi pwodwi Valè atribi
Part Status Active
RoHS Status ROHS3 Compliant
Pbfree Code yes
Mounting Type Through Hole
Packaging Bulk
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Style PC Pin
Operate Time 0.3ms
Power - Rated 10W
Current - Switching 500mA AC/DC
Current - Carry 700mA AC/DC
Voltage - Switching DC 150V
Length - Overall 0.449 11.40mm
RoHS Status ROHS3 Compliant
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MS-104-3-2 Dokiman yo

Telechaje fichye done ak dokiman manifakti pou MS-104-3-2

  • Fichye done yo

Gen lòt ki genyen ladan yo   "MS-10"   pati

Pati sa yo genyen ladan yo  'MS-10' 

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MS-10-140 Bel Terminal Blocks - Akseswa - Makè Sip 2794
MS-10-140 Cinch Connectivity Solutions Terminal Makè Strips
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MS-10-142 Bel Terminal Blocks - Akseswa - Makè Sip 2766
MS-10-142 Cinch Connectivity Solutions Terminal Makè Strips
MS-104-3-1 PIC GmbH Magnetik Reed Swich yo
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Ekselan Sèvis

Pwofesyonèl platfòm
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Livrezon nan vitès plen
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Si w gen nenpòt kesyon, ou ka kontakte nou byen vit nan fason sa yo:

Tel : 86-755-86374759

Imèl : [email protected]

Adrès : D1 6th floor,Lehui Center,Jihua Road 489 Longgang District, Shenzhen-518129, China

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Si ou gen nenpòt pwoblèm operasyon, tanpri ou lib pou kontakte sèvis kliyan nou an.
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MS-104-3-2 manifaktirè mak: PIC GmbH, Bonchip stock, MS-104-3-2 pri referans. MS-104-3-2 paramèt, MS-104-3-2 Fichye PDF ak deskripsyon dyagram pin download.Ou ka itilize MS-104-3-2 Pluggable Connectors, DSP Datesheet PDF, jwenn MS-104-3-2 dyagram pin ak dyagram sikwi ak metòd itilizasyon fonksyon, MS-104-3-2 leson patikilye elektwonik.Ou ka telechaje soti nan Bonchip.
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