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CL21A106KQCLNNC Espesifikasyon teknoloji

Cap Ceramic 10uF 6.3V X5R 10% SMD 0805 85C Cardboard T/R

Atribi pwodwi Valè atribi
Category CL21A106KQCLNNC
Manufacturer Samsung Electro-Mechanics
Factory Lead Time 3 Weeks
Factory Lead Time 22 Weeks
Mounting Type Surface Mount, MLCC
Terminal Shape WRAPAROUND
Operating Temperature -55°C~85°C
Published 2005
Size / Dimension 0.079Lx0.049W 2.00mmx1.25mm
JESD-609 Code e3
Pbfree Code yes
Moisture Sensitivity Level (MSL) 1 (Unlimited)
ECCN Code EAR99
Terminal Finish Matte Tin (Sn) - with Nickel (Ni) barrier
HTS Code 8532.24.00.20
Voltage - Rated DC 6.3V
Depth 1.25mm
Case Code (Imperial) 0805
Temperature Characteristics Code X5R
Height 850μm
Thickness (Max) 0.037 0.95mm
Radiation Hardening No
Lead Free Lead Free
Atribi pwodwi Valè atribi
Part Status Active
RoHS Status ROHS3 Compliant
Pbfree Code yes
Mount Surface Mount
Package / Case 0805 (2012 Metric)
Dielectric Material CERAMIC
Packaging Tape & Reel (TR)
Series CL
Tolerance ±10%
Feature Low Profile
Part Status Active
Number of Terminations 2
Temperature Coefficient X5R
Applications General Purpose
Capacitance 10μF
Packing Method TR, CARDBOARD PAPER, 7 INCH
Case Code (Metric) 2012
Capacitor Type CERAMIC CAPACITOR
Multilayer Yes
Length 2mm
Thickness 939.8μm
RoHS Status ROHS3 Compliant
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CL21A106KQCLNNC manifaktirè mak: Samsung Electro-Mechanics, Bonchip stock, CL21A106KQCLNNC pri referans. CL21A106KQCLNNC paramèt, CL21A106KQCLNNC Fichye PDF ak deskripsyon dyagram pin download.Ou ka itilize CL21A106KQCLNNC Pluggable Connectors, DSP Datesheet PDF, jwenn CL21A106KQCLNNC dyagram pin ak dyagram sikwi ak metòd itilizasyon fonksyon, CL21A106KQCLNNC leson patikilye elektwonik.Ou ka telechaje soti nan Bonchip.
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