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C1608C0G1E562J Espesifikasyon teknoloji

Cap Ceramic 0.0056uF 25V C0G 5% SMD 0603 125C T/R

Atribi pwodwi Valè atribi
Category C1608C0G1E562J
Manufacturer TDK Corporation
Factory Lead Time 3 Weeks
Mount Surface Mount
Number of Pins 2
Packaging Cut Tape
JESD-609 Code e3
Number of Terminations 2
ECCN Code EAR99
Terminal Finish Matte Tin (Sn) - with Nickel (Ni) barrier
Min Operating Temperature -55°C
Voltage - Rated DC 25V
Depth 800μm
Case Code (Imperial) 0603
Temperature Characteristics Code C0G
Height 0.8mm
Width 800μm
RoHS Status RoHS Compliant
Atribi pwodwi Valè atribi
Part Status Active
RoHS Status ROHS3 Compliant
Pbfree Code yes
Terminal Shape WRAPAROUND
Dielectric Material Ceramic
Tolerance 5%
Pbfree Code yes
Termination SMD/SMT
Temperature Coefficient 30 ppm/°C
Max Operating Temperature 125°C
Capacitance 5.6nF
Packing Method TR, 7 INCH
Case Code (Metric) 1608
Dielectric C0G
Multilayer Yes
Length 1.6mm
Radiation Hardening No
Lead Free Lead Free
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Adrès : D1 6th floor,Lehui Center,Jihua Road 489 Longgang District, Shenzhen-518129, China

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C1608C0G1E562J manifaktirè mak: TDK Corporation, Bonchip stock, C1608C0G1E562J pri referans. C1608C0G1E562J paramèt, C1608C0G1E562J Fichye PDF ak deskripsyon dyagram pin download.Ou ka itilize C1608C0G1E562J Pluggable Connectors, DSP Datesheet PDF, jwenn C1608C0G1E562J dyagram pin ak dyagram sikwi ak metòd itilizasyon fonksyon, C1608C0G1E562J leson patikilye elektwonik.Ou ka telechaje soti nan Bonchip.
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